Ignite Investment Summit Hong Kong Presentation

• Nanoveu showcases its EMASS semiconductor division and its ultra-low-power, AI-driven processing solutions
• EMASS's flagship ECS-DoT chip offers up to 20x more energy efficiency than peers
• ECS-DoT enables always-on AI inference and sensor fusion for edge computing applications

Nanoveu Limited (ASX: NVU, OTCQB: NNVUF), a technology innovator across advanced semiconductor, visualisation, and materials science, participated in the Ignite Investment Summit held in Hong Kong. The company's Chief Executive Officer of Semiconductor Technologies, Mr. Mark Goranson, presented the strategy for progressing its EMASS semiconductor division. EMASS is a pioneering technology company specialising in the design and development of advanced systems-on-chip (SoC) solutions, enabling ultra-low-power, AI-driven processing for smart devices, IoT applications, and 3D content transformation. The company's flagship ECS-DoT chip offers up to 20x more energy efficiency compared to leading competitors, allowing for always-on AI inference and sensor fusion capabilities in edge computing applications such as drones, wearables, and IoT devices. The presentation highlighted EMASS's global operations and R&D centres, as well as its experienced management team with deep expertise in AI/ML, neural network acceleration, semiconductor design, sensor fusion, and embedded systems. The company also discussed upcoming catalysts, including the 16nm tape-out of the next-generation ECS-DoT chip, ongoing OEM engagement, and the transition to live drone trials to validate the significant performance gains achieved with the EMASS solution.

Nanoveu is focused on driving commercial momentum for its EMASS semiconductor division, with key initiatives including the 16nm tape-out of the next-generation ECS-DoT chip, ongoing OEM engagement, and the transition to live drone trials to validate the significant performance gains achieved with the EMASS solution.