• Completed front-end, synthesis, and physical design for 16nm ECS-DoT Edge AI SoC
• Integrated Bluetooth Low Energy subsystem, expanded on-chip memory, and adaptive power management
• Added dedicated AI acceleration module for object detection and integrated floating-point unit

Nanoveu Limited (ASX: NVU, OTCQB: NNVUF) announced that its wholly owned subsidiary, Embedded A.I. Systems Pte. Ltd (EMASS), has achieved a major milestone in the development of its next-generation 16nm ECS-DoT AIoT system-on-chip (SoC). The 16nm ECS-DoT SoC has now completed the full front end, synthesis and physical design flow and has entered final GDS (Graphic Data Stream) sign-off, placing EMASS at the final stage ahead of tape-out and fabrication at TSMC. Key enhancements in the 16nm ECS-DoT SoC include: a fully integrated Bluetooth Low Energy subsystem, expanded on-chip SRAM memory, a new adaptive fine-grained power-management architecture, a dedicated AI acceleration module for object detection, and an integrated floating-point unit. These advancements position the 16nm ECS-DoT as a fully integrated edge intelligence SoC, combining compute and AI acceleration, wireless communication, expanded memory, and advanced low-power capabilities. Following tape-out and receipt of first 16nm ECS-DoT silicon, EMASS will undertake a structured silicon validation and characterization program to release measured power and performance metrics. This milestone reinforces EMASS's commitment to delivering cutting-edge, energy-efficient AI silicon designed for real-world deployment, marking an important step towards bringing the next generation of edge intelligence to partners and customers.

Nanoveu will provide further updates as ECS-DoT progresses through final GDS sign-off, tape-out, fabrication and subsequent silicon validation.