AI1 Price sensitive 6 Jan 2026, 9:28 AM

Adisyn Confirms Successful Low Temp Deposition Process

Adisyn Ltd

Adisyn Confirms Successful Low Temp Deposition Process

Key points

  • Independent expert confirms successful low-temperature deposition of an sp²-based carbon layer using an ALD system
  • Milestone achieved with deposition below 300°C, a key requirement for semiconductor integration
  • Successful demonstration represents an important technical validation and de-risking step in Adisyn's graphene deposition development program

Full summary

Adisyn Ltd (ASX: AI1) has announced that Milestone 1 under the Share Sale and Purchase Agreement (SPA) relating to its acquisition of 2D Generation Ltd (2DG) has been successfully achieved. Milestone 1 relates to the demonstration of low-temperature deposition of an sp²-based carbon layer onto a metallic substrate, using an Atomic Layer Deposition (ALD) system. Adisyn required demonstration of deposition of an sp²-based carbon layer on copper substrates at temperatures below 300°C, with confirmation of the material structure through Raman spectroscopy. The achievement of this milestone has been independently verified by Professor Yoram Selzer from the Faculty of Exact Sciences at Tel Aviv University, providing third-party validation of the technical outcomes. Low-temperature deposition is a critical requirement for semiconductor applications, and this achievement establishes a solid foundation as Adisyn continues to advance its graphene deposition development program. The company will now progress to the next phase, including expanding graphene deposition trials, refining pre-clean processes, optimizing deposition parameters, and characterizing deposited films to assess structure, quality, and electrical properties. Adisyn will continue to work with its international research collaborators to progress toward broader coupon-level testing and, subject to results, wafer-level evaluation.

Outlook

Adisyn will progress into the next phase of its graphene deposition development program, including expanding deposition trials, refining pre-clean processes, optimizing deposition parameters, and characterizing deposited films. The company will continue to work with its international research collaborators as it progresses toward broader coupon-level testing and, subject to results, wafer-level evaluation.

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