• Firm commitments to raise $7.5M via a Placement at $0.088 per Share
• Funds to support 16nm ECS-DoT tape-out, live drone validation, and commercial scale-up
• Strengthened balance sheet positions Nanoveu for accelerated global expansion of EMASS's Edge-AI semiconductor technology

Nanoveu Limited (ASX: NVU, OTCQB: NNVUF), a technology innovator across advanced semiconductor and material sciences, has received firm commitments to raise $7.5 million (before costs) through a placement of fully paid ordinary shares to new and existing sophisticated, professional, and institutional investors. The Placement will be conducted at an issue price of $0.088 per Share, with investors also receiving 1 free attaching option for every 2 new Shares subscribed for and issued, exercisable at $0.15 on or before the date that is 3 years from the date the options are issued. Nanoveu's Directors have committed to participate $120,000 in the Placement, subject to shareholder approval. The funds will be applied towards EMASS Semiconductor's 16nm ECS-DoT tape-out, live drone integration, commercialisation scale-up activities, R&D, as well as corporate, administration, and working capital, and EyeFly3D and nanocoating technologies. EMASS has delivered the final 16nm ECS-DoT GDS into the TSMC/IMEC workflow, initiating standard technical verification, integrity checks, and bug analysis that progress the program along the pathway toward light-mask preparation and tape-out readiness. In parallel, EMASS is progressing a structured drone evaluation program advancing from simulation into live flight validation in collaboration with a specialist U.S. drone firm. Phase 2 simulation campaigns reported endurance gains consistently exceeding 50% across platforms, with headline gains of up to 80% (quadcopter), 75% (hexacopter), and 85% (octocopter). The Placement will be completed within Nanoveu's existing ASX Listing Rule 7.1 and 7.1A placement capacities.

The Company is well positioned to convert technical momentum into major commercial outcomes with manufacturing readiness and real-world validation now underway.