Quarterly Activities/Appendix 4C Cash Flow Report
| Stock | Nanoveu Ltd (NVU.ASX) |
|---|---|
| Release Time | 30 Apr 2026, 8:08 a.m. |
| Price Sensitive | Yes |
Nanoveu Delivers 16nm Tape-Out, Strategic Placement and Expanded Edge-AI Applications
- 16nm ECS-DoT tape-out completed, with fabrication commencing at TSMC
- Successful A$7.5m capital raise to support commercialisation and silicon validation
- Expanded drone autonomy through exclusive NTU Singapore IP licensing
Nanoveu Limited (ASX: NVU), a technology innovator across advanced semiconductor, visualisation, and materials science applications, has provided its quarterly activities report for the period ended 31 March 2026. The quarter was marked by several key milestones, including the successful tape-out of the company's next-generation 16nm ECS-DoT Edge AI system-on-chip, the completion of a A$7.5m capital raise to support commercialisation and development activities, and the expansion of the company's drone autonomy capabilities through an exclusive IP licensing agreement with Nanyang Technological University, Singapore. The 16nm ECS-DoT chip represents a significant upgrade over the proven 22nm platform, featuring an integrated Bluetooth Low Energy subsystem, expanded on-chip SRAM, a dedicated object-detection accelerator, and advanced power management capabilities. The capital raise will enable Nanoveu to further progress the 16nm program, as well as support its drone and other edge-AI initiatives. The company also announced an exclusive licensing agreement with NTU Singapore, providing access to technologies that enhance drone navigation and swarm intelligence, complementing the endurance optimisation capabilities previously demonstrated. Nanoveu continues to focus on expanding the commercial reach of its 22nm ECS-DoT platform, advancing the 16nm program, progressing drone-related programs, and maintaining disciplined capital management to support its diverse technology portfolio.
Looking ahead, Nanoveu remains focused on: expanding 22nm ECS-DoT reference designs, advancing the 16nm ECS-DoT program through fabrication and silicon validation, progressing drone-related commercial and technical programs, and maintaining disciplined capital management to support commercialisation across its operating divisions.