• 50% of Stage-1 targeted 8,000 tpa PCB feedstock now secured under contract (4,000 tpa)
• Expands on existing long-term supply foundation established with Glencore
• Additional supply secured from reputable industry participants (names confidential)

Metallium Limited ('Metallium' or the 'Company') (ASX: MTM; OTCQX: MTMCF) is pleased to announce that it has now secured binding contracts covering 50% of its Stage-1 throughput target of 8,000 tonnes per annum ('tpa') of printed circuit board ('PCB') feedstock for its U.S. operations. This milestone builds on the Company's previously announced binding supply agreement with Glencore Ltd for up to 2,400 tpa of e-scrap feedstock and includes additional agreements with other established industry participants. Metallium's feedstock strategy is deliberately structured to balance supply certainty and commercial optimisation, targeting a contracted base of approximately ~70% of Stage 1 target (8,000 tpa), while retaining ~30% exposure to spot market procurement. This hybrid procurement model enables the Company to continuously benchmark and validate prevailing market pricing, maintain flexibility across feedstock grades and suppliers, and optimise margins through opportunistic purchasing. With feedstock now materially de-risked, Metallium is progressing commissioning at its Texas Technology Campus, including multi-reactor FJH installation and testing, together with ongoing studies into upstream pre-processing and downstream recovery pathways. The next key milestone is the multi-reactor FJH demonstration, which represents a critical scale-up inflection point, validating continuous operation and demonstrating that capacity can be expanded through modular replication.

Metallium is targeting ~70% contracted coverage of its Stage-1 feedstock target, with the balance to be sourced via spot market purchases. This hybrid procurement model is designed to maintain feedstock security while preserving pricing flexibility and market transparency as the company scales its operations.