dorsaVi Completes CMOS Fabrication for RRAM Validation Chip

Key points

• CMOS fabrication completion marks key milestone
• Established CMOS foundation for proprietary RRAM integration
• Wafers advance into proprietary RRAM integration
• Advances high-value physical AI markets

Full summary

Dorsavi Limited (ASX: DVL) has completed the front-end-of-line (FEOL) transistor fabrication and middle-of-line (MOL) interconnects for its first RRAM-CMOS validation chip using TSMC's CMOS process. This foundational CMOS platform allows the validation wafers to advance into Dorsavi's proprietary back-end-of-line (BEOL) RRAM integration sequence, beginning with the fabrication of dedicated BEOL integration structures, followed by RRAM stack deposition, RRAM cell etching, and subsequent metal lines and interconnects. This milestone advances Dorsavi's pathway toward an electrically testable RRAM-CMOS validation chip and its broader roadmap for low-power Physical AI hardware.

Outlook

Dorsavi looks forward to reporting against the next defined milestones as the program progresses.