• OEM design-ins of existing ECS-DoT SoC 22nm solution, with key U.S. Sales Network established
• ECS-DoT Landmark Drone Energy Efficiency Results, Averaging 60% Extended Flight Times with Sub 1mW AI Control
• Tape-out Progress of New Integrated Circuit on TSMC's 16nm FinFET Process

Nanoveu Limited (ASX: NVU, OTCQB: NNVUF), a technology innovator across advanced semiconductor, visualization, and materials science, is holding an investor webinar to present its latest developments. Key highlights include the OEM design-ins of the existing ECS-DoT SoC 22nm solution, with a key U.S. Sales Network established, the ECS-DoT Landmark Drone Energy Efficiency Results averaging 60% extended flight times with sub 1mW AI control, and the tape-out progress of a new integrated circuit on TSMC's 16nm FinFET process. The company's subsidiary, EMASS, is a pioneering fabless semiconductor innovator in edge AI processing, offering ultra-low-power edge AI SoCs for always-on intelligence in battery-constrained devices. The presentation covers EMASS's global operations, expert team, and semiconductor leadership, as well as the key operational updates, market opportunity, and performance advantages of the ECS-DoT chip. The webinar also highlights the drone market opportunity and the testing methodology used to validate the significant flight time improvements achieved with the ECS-DoT chip.

Nanoveu is focused on driving OEM engagement and design-ins for its existing ECS-DoT 22nm solution, while also progressing the tape-out of its new 16nm integrated circuit. The company is well-positioned to capitalize on the growing edge AI and drone market opportunities with its innovative semiconductor technology.